DESCRIPTION PACKAGE DIMENSIONS The �PA1552B is N-channel Power MOS FET Array in millimetersthat built in 4 circuits designed, for solenoid, motor and 26.8 MAX. 4.0lamp driver.FEATURES 10� 4 V driving is possible 2.5� Large Current and Low On-state Resistance 10 MIN. ID(DC) = �5.0 A 2.54 1.4 RDS(on)1 0.18 MAX. (VGS = 10 V, ID = 3 A) 1.4 0.6�0.1 0.5�0.1 RDS(on)2 0.24 MAX. (VGS = 4 V, ID = 3 A)� Low Input Capacitance Ciss = 200 pF TYP. 1 2 3 4 5 6 7 8 910ORDERING INFORMATION CONNECTION DIAGRAMType Number Package 3 5 7 9�PA1552BH 10 Pin SIP 2 4 6 8ABSOLUTE MAXIMUM RATINGS (TA = 25 �C) 1 10Drain to Source Voltage VDSS Note 1 60 V VGate to Source Voltage VGSS Note 2 �20 A/unit ELECTRODE CONNECTION A/unit 2, 4, 6, 8 : GateDrain Current (DC) ID(DC) �5.0 W 3, 5, 7, 9 : Drain W 1, 10 : SourceDrain Current (pulse) ID(pulse) Note 3 �20 �C �CTotal Power Dissipation PT1 Note 4 28 A mJTotal Power Dissipation PT2 Note 5 3.5Channel Temperature TCH 150Storage Temperature Tstg �55 to +150Single Avalanche Current IAS Note 6 5.0Single Avalanche Energy EAS Note 6 2.5Notes 1. VGS = 0 2. VDS = 0 3. PW 10 �s, Duty Cycle 1 % 4. 4 Circuits, TC = 25 �C 5. 4 Circuits, TA = 25 �C 6. Starting TCH = 25 �C, V DD = 30 V, VGS = 20 V 0, RG = 25 , L = 100 �H The diode connected between the gate and source of the transistor serves as a protector against ESD. When thisdevice is actually used, an additional protection circuit is externally required if a voltage exceeding the rated voltagemay be applied to this device.Document No. G10599EJ2V0DS00 (2nd edition) � 1995Date Published December 1995 PPrinted in Japan �PA1552BELECTRICAL CHARACTERISTICS (TA = 25 �C) CHARACTERISTIC SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNIT Drain Leakage Current IDSS VDS = 60 V, VGS = 0 10 �A Gate Leakage Current IGSS VGS = �20 V, VDS = 0 1.0 0.09 �10 �A Gate Cutoff Voltage VGS(off) VDS = 10 V, ID = 1.0 mA 2.4 0.12 2.0 V Forward Transfer Admittance | Yfs | VDS = 10 V, ID = 3.0 A 200 S Drain to Source On-State RDS(on)1 VGS = 10 V, ID = 3.0 A 150 0.18 Resistance RDS(on)2 VGS = 4.0 V, ID = 3.0 A 55 0.24 Ciss VDS = 10 V, VGS = 0, f = 1.0 MHz 20 pF Input Capacitance Coss 100 pF Output Capacitance Crss ID = 3.0 A, VGS = 10 V, VDD �=� 30 V, 670 pF Reverse Transfer Capacitance td(on) RL = 10 310 ns Turn-on Delay Time tr 13 ns Rise Time td(off) VGS = 10 V, ID = 5.0 A, VDD = 48 V ns Turn-off Delay Time tf 2 ns Fall Time QG IF = 5.0 A, VGS = 0 4.7 nC Total Gate Charge QGS IF = 5.0 A, VGS = 0, di/dt = 50 A/�s 1.0 nC Gate to Source Charge QGD 280 nC Gate to Drain Charge VF(S-D) 820 V Body Diode Forward Voltage trr ns Reverse Recovery Time Qrr nC Reverse Recovery ChargeTest Circuit 1 Avalanche Capability Test Circuit 2 Switching Time D.U.T. RG = 25 L D.U.T. PG 50 RL VGS VGS (on) 90 %VGS = 20 V 0 VGS 0 10 % VDD RG Wave Form PG. RG = 10 VDD ID 90 % 90 % ID ID 10 % 0 10 % tf BVDSS VGS Wave Form td (on) VDS 0 IAS tr td (off) ID t VDD ton toff t = 1 �s Starting TCH Duty Cycle 1 % Test Circuit 3 Gate Charge D.U.T. IG = 2 mA RL PG. 50 VDD2 �PA1552BCHARACTERISTICS (TA = 25 �C) TOTAL POWER DISSIPATION vs. TOTAL POWER DISSIPATION vs. AMBIENT TEMPERATURE CASE TEMPERATURE 6 Under same 30 Under same dissipation in NEC each circuit dissipation in 4 Circuits operation � PA1552BH Lead 3 Circuits operationPT - Total Power Dissipation - W5 PT - Total Power Dissipation - W each circuit,,,,,,, Print 4 Circuits operation Circuit &